JPH0223001Y2 - - Google Patents
Info
- Publication number
- JPH0223001Y2 JPH0223001Y2 JP14765684U JP14765684U JPH0223001Y2 JP H0223001 Y2 JPH0223001 Y2 JP H0223001Y2 JP 14765684 U JP14765684 U JP 14765684U JP 14765684 U JP14765684 U JP 14765684U JP H0223001 Y2 JPH0223001 Y2 JP H0223001Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- reinforcing member
- reinforcing
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 230000007423 decrease Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000002787 reinforcement Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14765684U JPH0223001Y2 (en]) | 1984-09-29 | 1984-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14765684U JPH0223001Y2 (en]) | 1984-09-29 | 1984-09-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6163862U JPS6163862U (en]) | 1986-04-30 |
| JPH0223001Y2 true JPH0223001Y2 (en]) | 1990-06-21 |
Family
ID=30705883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14765684U Expired JPH0223001Y2 (en]) | 1984-09-29 | 1984-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0223001Y2 (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2745709B2 (ja) * | 1989-08-22 | 1998-04-28 | 株式会社デンソー | フレキシブルプリント配線板 |
| JP5651933B2 (ja) * | 2009-07-15 | 2015-01-14 | 大日本印刷株式会社 | サスペンション用基板およびその製造方法 |
| JP2019036616A (ja) * | 2017-08-14 | 2019-03-07 | 住友電気工業株式会社 | フレキシブルプリント配線板 |
-
1984
- 1984-09-29 JP JP14765684U patent/JPH0223001Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6163862U (en]) | 1986-04-30 |
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